Company Profile

•Established in 2003,more than 16 years electronic manufacturing experiences.

•Area: 7000sqm

•Employee: 250 people

•Certification ISO 9001:2008

•PCB , PCBA, Box Build , Testing, Component source.

•Manufacture include consumer ,Automotive , Industrial, Communication, Medical products.

Production capability

•STM lines: 8 lines

•DIP Line ： 1 line

•Assemble line： 3 Lines moment (Upon customer requirement)

•SMT  Chip components :     01005 and Above(Already mass produce on 01005

•IC /BGA/ μBGA  Max Size： 50mm*50mm

•Min pitch:0.30mm

•SMT production Capacity:10 million dots per day

•DIP production Capacity: 150 thousand point per day

•Function Testing: Upon customer requirement

•Box build/Assemble: Upon customer requirement

EQUIPMENT LIST

• Solder paste printer： GKG G9 4sets，GKG G5 5 sets

•Panasonic High Speed Chip Mounter： NPM-D3 3sets，NPM-TT2 1 sets，CM602 8 sets，BM231 3sets，  CM101 1set

•3D SPI:   8sets （Each line with Sinic-Tek SPI)

•AOI:Online AOI 8 sets

•Hot air reflow oven : 7 sets FolungWin oven with N2, 1 sets HB dual rail oven

•3D X-Ray:1set

•FAI Test system：2set

•ICT Testing：3sets

•Drying cabinet ：1se

•Moisture proof cabinet ：1set

•PCB curve automatic dividing machine： 1set

•V cut PCB distributor machine：3sets